Publication: Intermetallic compound properties of sn-bi/cu solder joints by microwave hybrid heating
| datacite.subject.fos | oecd::Engineering and technology::Materials engineering::Materials engineering | |
| dc.contributor.author | Low, Huey Mei | |
| dc.date.accessioned | 2025-10-15T09:05:03Z | |
| dc.date.available | 2025-10-15T09:05:03Z | |
| dc.date.issued | 2025-08-08 | |
| dc.description.abstract | This study investigates the IMC properties of Sn-58Bi/Cu solder joints fabricated using MHH. The research aims to evaluate the effects of MHH on IMC formation, microstructure and mechanical properties of solder joints. Sn-58Bi solder was reflowed on Cu substrates under varied MHH conditions (20–80 s) to determine optimal processing parameters. Wettability and spreadability analysis showed improved solder performance with increasing heating time, reaching an optimal balance at 40 s with a wetting angle of 29.16° and spreading ratio of 92.91%. SEM-EDX analysis confirmed uniform and continuous IMC layers dominated by Cu₆Sn₅ phases while XRD characterization validated phase formation at both cross and top surfaces. Vickers hardness testing for both surfaces revealed a gradient of increasing from the solder matrix (23.6–39.6 Hv) to the Cu substrate (273.3–368.1 Hv) with IMC layers displaying intermediate hardness values (42.7 Hv for cross surface and 214.9 Hv for top surface). The results demonstrate that optimized MHH processing enhances microstructural uniformity, controls IMC growth and improves mechanical integrity which making it a promising approach for reliable lead-free soldering in electronic packaging applications. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/22825 | |
| dc.language.iso | en | |
| dc.title | Intermetallic compound properties of sn-bi/cu solder joints by microwave hybrid heating | |
| dc.type | Resource Types::text::report::technical report | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |