Publication: Application of the year vapor chamber in electronic device
| datacite.subject.fos | oecd::Engineering and technology::Mechanical engineering | |
| dc.contributor.author | Teoh, Chee Keong | |
| dc.date.accessioned | 2024-08-02T03:22:10Z | |
| dc.date.available | 2024-08-02T03:22:10Z | |
| dc.date.issued | 2008-04-01 | |
| dc.description.abstract | he different of thermal performance is evaluated on a flat plate type heat pipe called "vapour chamber" which containing different microwick structures for cooling microprocessors in electronic devices application. The vapour chamber is an advanced cooling heat spreader for high-performance mirochips, such as new generation CPUs in personal computers and workstation. Microwick structure plays a key role in obtaining the small spreading thermal resistance and the high heat transport resulting from film evaporation in the microchannel. Wick column inside the vapour chamber is used to circulate the working fluid. Cooling performance was examined by measuring the working temperatures and thermal resistance for the various heat input and for three different wick structures. Thermocouples are used to measure the working temperature and DC power regulator is used to supply the power. In this project, thermal performance of vapor chamber is different with the different wick structures. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/20009 | |
| dc.language.iso | en | |
| dc.title | Application of the year vapor chamber in electronic device | |
| dc.type | Resource Types::text::report | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |