Publication: Optimization of tin and other base metals recovery from waste printed circuit boards (WPCBS) via hydrometallurgy
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Date
2025-07
Authors
Nur Balqis Najihah binti Zaidan
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Abstract
The increasing generation of electronic waste (E-waste), especially from waste printed circuit boards (WPCBs). This study focuses on the objectives to characterize raw materials residue and leached residue of waste printed circuit boards (WPCBs) using X-Ray Fluorescence (XRF) and X-Ray Diffraction (XRD) analysis and to determine the significant parameters recovery of tin and other base metals from waste printed circuit boards (WPCBs) by characterization optimized hydrometallurgical process using oxidative hydrochloric acid, 𝐻𝐶𝑙 leaching with hydrogen peroxide, 𝐻2𝑂2, as an oxidant. A sequential selective leaching system were employed utilizing the concentration of hydrochloric acid (HCl) in combination with hydrogen peroxide (H₂O₂) as an oxidizing agent. The influence of process parameters including acid concentration, oxidant dosage, temperature, solid-to-liquid ratio and leaching time was systematically investigated using a full factorial design of experiment (DOE) and were analysed using analytical of variance (ANOVA) to identify optimal recovery conditions. The characterization of raw and leached residues was conducted using X-Ray Fluorescence (XRF), while metal recovery efficiency was assessed through quantitative analysis. Results revealed that the highest recovery of Sn (83.4 %) was achieved at 5M HCl concentration and 15 mL / hour of H₂O₂, alongside significant recovery of Cu and Pb of 50.7%. Statistical analysis through ANOVA indicated that the factor of oxidation rate had the most significant effect on Sn and Pb recovery.