Publication: Numerical modelling and simulation for dynamic response and fatigue life prediction of printed circuit board
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Date
2023-07-06
Authors
Lou, Jing Yi
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Abstract
In everyday life, PCB in electronics is receiving impact from various sources such as vibrational damage, fall damage, or thermal damage via abusive usage or act from users. Hence, designers and engineers should identify the durability and quality of their PCB design to ensure the electrical circuit of electronic gadgets provided by the solder ball connecting the PCB and BGA package mechanically will not fail easily via product reliability testing with reference to JEDEC standards. To reduce material wastage in the reliability testing stage, FEA simulation came up as a viable solution to this conflict. In this study, a simplified 3D geometrical PCBA model with accurate material data obtained from literature is simulated with controlled boundary conditions, which act as the cyclic fatigue loading sustained by the PCBA. Differing from the conventional mean, BLCBT is used rather than BLDT due to its better result reproducibility and accuracy. The simulated PCBA model is subjected to cyclic bending load with similar magnitude in both upward and downward directions discretely to identify the effect of loading conditions towards the plasticity damage sustained by the most critical solder ball. Besides, the PCBA is also subjected to low cycle fatigue loading (100 cycles) and higher cycle fatigue loading (500 cycles) to obtain the trend of plasticity damage sustained by the most critical solder ball. Finally, the equivalent
plastic strain sustained by the solder ball from the simulation result is exported and the fatigue life of PCBA is calculated using Manson-Coffin fitted low cycle fatigue life numerical model for metal. The strain against the life curve of PCBA is predicted using the Manson-Coffin equation and post-processed using MATLAB.