Publication: Analisis retak dalam pakej elektronik penentuan orientasi dan sudut retak
| datacite.subject.fos | oecd::Engineering and technology::Mechanical engineering | |
| dc.contributor.author | Jasni, Saiful Nizam | |
| dc.date.accessioned | 2024-08-09T08:06:31Z | |
| dc.date.available | 2024-08-09T08:06:31Z | |
| dc.date.issued | 2001-02-01 | |
| dc.description.abstract | Crack phenomenon on electronic packaging is very serious and very threatening situation. These phenomenon is one of the main factor for common cause of failure on electronic packages. This failure are the primary contributor for a very huge losses suffer by the manufacturer and consumer alike. The presence of crack on electronic packages will cause the package to failed during its operation. In this analysis the main focus will be given to analyze the crack phenomenon on packages and the main subject is to focus on the tendency of a crack to propagate with respect to angle applied. The main parameter that will be consider here will be the value of G (strain energy released rate) and K (stress intensity factor). This two parameter is the main factor that could explained the behavioral nature of crack. This parameter will be analyze using a linear elastic fracture modulus (LEFM) concept develop by Griffith and Irwin. The value of K and G will be analyze using the method of MCCI (modified closed closure integral) on which a few primary data will be abstract from the result obtained from simulation. The main objective to be achieve in this analysis is, to obtained a trend that reflect the crack tendency to happened with respect to the angle applied. This can be observe as a result from the graft plotted between the value of G with respect to the kink angle. The G value will be computated using an MCCI approach on which the primary data are obtained from the simulation result. In this analysis, IDEAS Master Series 6A will be used as the main software to solve the model that has being made. There are three stages on using IDEAS and those are, modeling, analyzing and finally step involved pre processing. In the analysis IDEAS will be used to conduct a finite element method on solving the model. It must be made clear here that the solution done are in the form of linear static and with in a steady state condition. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/20195 | |
| dc.language.iso | en | |
| dc.title | Analisis retak dalam pakej elektronik penentuan orientasi dan sudut retak | |
| dc.type | Resource Types::text::report | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |