Publication: Penggunaan konduktif terma poliuretana sebagai bahan terma antaramuka yang mungkin
| datacite.subject.fos | oecd::Engineering and technology::Materials engineering | |
| dc.contributor.author | Wong, Yoke Pei | |
| dc.date.accessioned | 2024-07-16T09:57:33Z | |
| dc.date.available | 2024-07-16T09:57:33Z | |
| dc.date.issued | 2005-03-01 | |
| dc.description.abstract | The possibility of using polyurethane as the matrix of a thermal interface material (TIM) was investigated. The effect of different kinds of filler and various filler loading on the characteristic of the TIMs also investigated. In this study, alumina, aluminium nitrate and silicon carbide were used as reinforcements in polyurethane matrix. The thermal and mechanical properties were evaluated. The results show that further increase of the filler content increases the thermal conductivity of the TIMs where the sample with 30 volume percent of filler poses higher thermal conductivity than those of 25, 20, 10, 5 and 0 volume percent. As expected, the thermal conductivity is governed by the number of conductive networks between the fillers. Here, the thermal stability of TIMs improved with the addition of filler. Thermogravimetry Analyzer (TGA), Thermal Cycle Testing and the Hardness Test after thermal cycle testing had proved this. The Thermo mechanical analyzer (TMA) showed that CTE of the material decreases by increasing filler contents. From the micrograph of the SEM (Scanning Electron Microscope), found that the filler are distributed uniformly inside the matrix and the adhesion and wetability of the filler with the matrix (Polyurethane) are good. Meanwhile, Dynamic Mechanical Analysis (DMA) show that the storage modulus of the samples was increase with increases of filler content but it is stabile in the service temperature. The phase angle Tan D of the samples decrease with increases of filler content. Therefore, thermally conductive polyurethane can used as the TIM material. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/19736 | |
| dc.language.iso | en | |
| dc.title | Penggunaan konduktif terma poliuretana sebagai bahan terma antaramuka yang mungkin | |
| dc.type | Resource Types::text::report | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |