Publication: Effect of epoxy moulding compound viscosity on the led encapsulation process
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Date
2024-07
Authors
Andrew, Neoh Zeng En
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Abstract
The LED encapsulation process in high-power LED applications faces significant challenges that impact the reliability of the LED, with wire deformation during the LED encapsulation process being a primary concern affecting the life expectancy of LED. The research aimed to investigate the effect of epoxy moulding compound (EMC) viscosity on the LED encapsulation process. ANSYS Fluent is utilized to simulate the volume of epoxy moulding compound (EMC) dispensed onto the LED using the volume of fluid (VOF) strategy and user-defined function (UDF). The study varies the viscosity of the epoxy moulding compound (EMC) (0.100 kg/ms), (0.290 kg/ms) (0.448 kg/ms), (0.500 kg/ms), and (1.450 kg/ms) with fixed parameters for injection speed, injection time, and inlet contact angle. An experimental test validates the final structure of the EMC obtained from the simulation setup. The smaller the mesh type which is the mesh size, the greater the number of nodes and elements which results in greater computational time. The results demonstrated that 100% of the time, the EMC epoxy at 0.448 kg/ms viscosity created an exact hemispheric shape on the LED substrate. The most stable epoxy during the LED encapsulation process was the EMC epoxy (0.448 kg/ms), which showed the most stable rising trend for the water volume fraction over the course of the flow duration. The results obtained indicate that lower EMC viscosity results in shorter flow time needed for the LED encapsulation process to be completed. Correspondingly, higher EMC viscosity results in longer flow time needed for the LED encapsulation process to be completed