Publication: Development of polymer/nanoparticles for encapsulation molded compound
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Date
2025-08-08
Authors
Siti Aishah Batrisyia binti Hamdan
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Abstract
Electronic packaging plays a critical role in protecting semiconductor devices to ensure electrical connectivity, and facilitate heat dissipation. As electronic devices become more compact and powerful, packaging materials must meet stricter performance demands. While epoxy molding compounds (EMCs) are widely used for encapsulation, their high coefficient of thermal expansion (CTE) often leads to failures such as delamination and thermal stress when paired with silicon die. The objective of this investigation is the development of polymer matrix as encapsulation materials by addition of nanoparticles (NPs) such as titanium dioxide (TiO₂) and zinc oxide (ZnO) to produce high-performance encapsulating materials that exhibit reduced CTEs and enhanced thermal stability. In this research, polyimide (PI) was being investigated as an alternative matrix to reduce thermal mismatch because of its inherently lower CTE. NPs’ surface was modified with silane coupling agents and dispersed by ultrasonic treatment to enhance the filler-matrix bonding. The curing agent was then mixed with the resin, degassed, and cured. Key processing parameters include NP loading (2, 4, 6, 8 wt%), curing temperature (60, 70, 80, 90 °C), and curing time (3, 6, 12, 18, 24 hrs) of PI were systematically studied. The 4 wt% TiO₂/PI nanocomposite significantly reduced CTE to 9.8 ppm/°C from 23.18 ppm/°C in pristine PI which brings it closer to the CTE of silicon die of 6.18 ppm/°C while also showing good particle dispersion and strong filler–matrix interactions as evidenced by FTIR and FESEM. TGA analysis confirmed that the TiO₂/PI nanocomposites exhibited improved thermal stability as compared to pristine PI. Optimal processing was achieved at 80 °C for 24 hours, confirmed by FTIR and OM indicating complete imidization and void-free morphology respectively. The 4 wt% TiO₂/PI anocomposites demonstrate the possibility of developing promising encapsulating materials for use in advanced electronic packaging, based on the dimensional and thermal performance enhancements. These materials will improve reliability, durability, and efficiency in electronic packaging by minimizing thermal misfit with silicon die.