Publication: Nano-indentation investigation on lead free solder interconnection prepared by microwave hybrid heating
| datacite.subject.fos | oecd::Engineering and technology::Mechanical engineering | |
| dc.contributor.author | Sivakanesh a/l Magesvaran | |
| dc.date.accessioned | 2025-09-12T04:23:00Z | |
| dc.date.available | 2025-09-12T04:23:00Z | |
| dc.date.issued | 2024-07-05 | |
| dc.description.abstract | The adoption of lead-free solder, specifically Sn-Ag-Cu (SAC), in electronic manufacturing was driven by concerns for human health and environmental impact. The reflow process utilized during soldering plays a significant role in the formation and growth of the intermetallic compound (IMC) layer, crucial for ensuring reliable solder and metal substrate connections. While microwave hybrid heating (MHH) presents a potential soldering approach, the long-term reliability of solder joints remains uncertain. To address this, a study was conducted to examine the impact of MHH on IMC morphology and thickness in SAC305 solder. Additionally, the mechanical properties of SAC305, such as elastic modulus and stress-strain were evaluated using nanoindentation. The obtained results were further supported by finite element modelling using ABAQUS software. The IMC structure exhibited a planar-like shape in MHH, occurring after 200s of reflow time for MHH. Besides, a comparison between the experimental results and simulation results were conducted. Comparison between the SAC305 and SAC105 solder, the temperature between SAC305, different amount of load applied in the simulation process and cyclic loading were carried out to obtain the mechanical properties of both SAC305 and SAC105.The proposed finite element modelling demonstrated good agreement with experimental data, showcasing its capability to simulate the plastic deformation behaviour during the indentation process. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/22609 | |
| dc.language.iso | en | |
| dc.title | Nano-indentation investigation on lead free solder interconnection prepared by microwave hybrid heating | |
| dc.type | Resource Types::text::report::technical report | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |