Publication: A study of crack behavior in a qfp electronic package under the combination of thermal and pressure loading
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Date
2002-03-01
Authors
Awang, Azizo
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Abstract
Crack is one of the primary problems faced in packaging. This phenomenon happened
because of some factors such as thermal and pressure loading and unsuitable material is
used. It caused losses suffer by the manufacturer and consumer alike. This is because the
presence of crack in electronic package will cause package to fail during operation. Thus,
many researches have been done about crack in electronic package. For this project, the
study is to determine crack behavior in a QFP electronic package under the combination of
thermal and pressure loading.
The value of G (strain energy release rate) and K (stress intensity factor) are primary
measurement to explain crack behavior. To get this value, Modified Crack Closure Integral
(MCCI) method is used. Beside that, the understanding of linear elastic fracture mechanics
(LEFM) concept is important because it was related with the parameters G and K.
IDEAS Master Series 8A (Open GL) will be used as a main software to solve the model to
get the primary data. There are three stages on using IDEAS which are modeling,
analyzing and post processing. In this analysis, IDEAS will use finite element analysis
(FEA) method to solve the model.
The main objective of this study is to determine package behavior under the combination
of thermal and pressure loading. For that, two analyzed cases are used. Firstly, thermal and
pressure loading with variable distance of pressure at crack and secondly is thermal and
pressure loading with variable values of pressure.