Publication: Application of jet impingement in the cooling of electronic products
| datacite.subject.fos | oecd::Engineering and technology::Mechanical engineering | |
| dc.contributor.author | Sanjiv, Nair Sagaram | |
| dc.date.accessioned | 2024-09-23T04:39:23Z | |
| dc.date.available | 2024-09-23T04:39:23Z | |
| dc.date.issued | 2002-03-01 | |
| dc.description.abstract | Jet impingement cooling has long been used in the industries for controlling temperature in material processing, cooling equipments, cryosurgery and electronics cooling. It has been identified to be useful to electronics cooling due to its high heat removal capabilities. Electronic systems have now grown smaller resulting in very high heat generation compared to previous systems, requiring cooling solutions such as jet impingement. Jet impingement cooling in electronic packages is carried out numerically using FLUENTTM. The local heat transfer coefficients on a heat source due to a normally impinging, axisymmetric, confined and submerged liquid jet are investigated. Numerical predictions are made for nozzle diameter of 3.18 mm at several nozzles to target plate spacing (H/d) ranging from 2 to 4. The Reynolds numbers considered are 8500, 10000 and 13000 with a perfluorinated dielectric fluid Fluorinert-77 (FC-77) as the working fluid. The flow field and heat transfer are solved using the standard high Reynolds number k- turbulence model. A more detailed mesh refinement compared to previous investigations is utilized. The results of the analysis show the flow field predictions and the temperature contours to be similar to the results obtained experimentally by researchers. It was found that when the nozzle to target plate spacing (H/d) increases, the primary toroidal recirculation zone moves further away from the jet axis and closer to the target plate. The temperature gradient near the stagnation zone is also found to be less compared to that near the end of the heat source. The local and average heat transfer coefficients are also calculated and are presented together with the analysis where it was noted that as Reynolds numbers and H/d increases, the heat transfer coefficients increases. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/20524 | |
| dc.language.iso | en | |
| dc.title | Application of jet impingement in the cooling of electronic products | |
| dc.type | Resource Types::text::report | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |