Publication: Leadframe defect detection using flatbed scanner
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Date
2008-03-01
Authors
Yan, Hon Loon
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Abstract
Leadframe is an important component in the semiconductor industry as it provides a base for the integrated circuit chip to be mounted on for support and an electrical connection for the circuit and the printed circuit board. Unfortunately, the production of leadframe also faces the problem of having defects which causes lead frame rejections and wastage of production costs and materials. At present, machine vision systems using a charged couple device (CCD) camera is being used in leadframe inspection as a mean of detecting these defects. However, the cost of using a CCD camera is rather high as an interface for the PC is also needed to read the image. The objective of this project is to determine whether a flatbed scanner can be used in leadframe inspection instead of a CCD camera as the cost of using flatbed seanners is less than CCD cameras. An algorithm was also developed to process the image scanned by the flatbed scanner so that it can be used for leadframe inspection. This project uses a flatbed scanner, a PC and MATLAB software. The images were scanned in grayscale mode using the resolutions of 600 dpi and 1200 dpi. The algorithm developed uses several image processing methods such as morphological closing and image subtraction to detect the defects. The images and algorithm has been successfully tested on leadframes with simulated defects on multiple modules. In conclusion, the results shows that a flatbed scanner can be used to perform leadframe inspection and the algerithm usedi need not have any filtering operations.