Publication: Thermal strain measurement with digital image correlation (dic)
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Date
2024-07-01
Authors
Sze Kea Guan
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Abstract
Thermal Strain is one of the most important parameters during the manufacturing of electronic components, typically during the soldering of Printed Circuit Board (PCB). In this study, aluminium with various dimension, which includes 7 cm by 0.5 cm, 7 cm by 1 cm, 7 cm by 2 cm, 7 cm by 4 cm and lastly 7 cm by 8 cm were used to replace the use of actual Printed Circuit Board, in order to investigate the relationship between expansion of the aluminium plates due to heating and its thermal strain. In the experiment, random speckles were sprayed on every aluminium plate and each aluminium specimen was heated up to 100 degree Celsius using Static Reflow Oven to ensure a more uniform and consistent heating process. Meanwhile, handphone camera was used to record the changes of the aluminium plate upon heating through the window on the static reflow oven. The next step would be the processing of strain using DaVis Software. The working principle of DaVis software was based on the Digital Image Correlation DIC principle, whereby the software will capture the displacement of the speckles on the specimen and calculate its strain. Based on theoretical knowledge, the thermal strain for any isotropic material should be constant regardless of the size of the specimen. However, based on the DIC results, the thermal strain of the material increases as the size of the aluminium plate getting larger. As a result, the percentage error also rises as the dimension of aluminium plate increases. This is due to several significant error such as low resolution of camera used, heat transfer problem and human error. Therefore, an improved data collection method and higher resolution camera should be implemented as to improve the accuracy of the results in the future study.