Publication: A study of manufacturing process and structural integrity of corroded sac305 lead free solder
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Date
2023-07-01
Authors
Muhammad Afif Aiman Bin Muhd Taufiq
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Abstract
The growing demand for lead-free solder alloys in the electronics industry has necessitated a comprehensive understanding of their manufacturing process and the structural integrity of solder joints under corrosive conditions. This study aims to investigate the manufacturing process and evaluate the structural integrity of corroded SAC305 lead-free solder.
The research methodology involves a combination of experimental analysis and characterization techniques. The manufacturing process of SAC305 solder will be examined, focusing on parameters such as reflow profile and different heating techniques. Various characterization techniques, including scanning electron microscopy (SEM), and Vickers Hardness Test, will be employed to assess the microstructure and the hardness of the solder joints. The results from the wetting angle and spreading ratio for medium operating power such as M120s has a wetting angle and spreading ratio of 15.18° and 93.48° respectively, showed that it has higher wettability compared to high operating power such as H60s has a wetting angle and spreading ratio of 16.76° and 93.03°.
To investigate the effects of corrosion on the structural integrity of SAC305 solder, accelerated corrosion tests will be conducted using appropriate corrosive environments. The solder joints will be subjected to controlled exposure to corrosive solution, such as 3.5%wt NaCl solution which simulating real-world operating conditions. The structural integrity of the corroded solder joints will be evaluated through characterization techniques such as scanning electron microscopy (SEM). The comparison between the corroded SAC305 and non-corroded SAC05 was investigated based on the results of the analysis.
The findings of this study will contribute to enhancing the understanding of the manufacturing process of SAC305 solder and the effects of corrosion on its structural integrity. The results will assist in developing guidelines for optimized manufacturing practices and design considerations to mitigate corrosion-induced failures in lead-free solder joint