Publication: Thermal impact of thermal interface materials and heat spreader co-planarity of the electronic packaging
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Date
2020-06-01
Authors
Pang, Shi Shiang
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Abstract
This thesis presents the thermal impact of thermal interface material 1 (TIM1) and heat spreader co-planarity to the flip chip package with heat spreader. The TIM1 material influences the efficiency of heat transfer from silicon die to the heat spreader while the co-planarity of heat spreader affects the thermal performance of the flip chip package significantly, especially on the junction-to-case thermal resistance of the package. Numerical studies using ANSYS Icepak were conducted to investigate the thermal impact contributed by the TIM1 material properties and thermal degradation due to heat spreader co-planarity in either concave or convex with deflections up to 0.12 mm. The result indicated that the bond line thickness (BLT) and the thermal conductivity of the TIM1 material affected the thermal performance of the flip chip package. The result also showed that with concave deflection improved up to 44 % while convex deflection degraded up to 80 % of the junction-to-case thermal resistance of the flip chip package. The outcome of the study is to propose design guidelines and recommendations for TIM1 material selection and implementation. Higher thermal conductivity and lower the BLT of TIM1 material shall be selected for better thermal performance of the flip chip package. The findings also recommended the co-planarity tolerance for the heat spreader shall not be greater than 0.07 mm for a 60 mm x 60 mm flip chip package with a heat dissipation of 150 W.