Publication: Thermal dissipation over high-power led enclosure
| datacite.subject.fos | oecd::Engineering and technology::Mechanical engineering::Mechanical engineering | |
| dc.contributor.author | Amos, Liew Chee Han | |
| dc.date.accessioned | 2025-08-29T03:55:53Z | |
| dc.date.available | 2025-08-29T03:55:53Z | |
| dc.date.issued | 2024-07-25 | |
| dc.description.abstract | With the advent of higher power LED modules, the need for efficient heat dissipation methods is recognized. This research focuses on simulating and optimizing the thermal dissipation performance of through-hole enclosures for high-power LED streetlights. The investigation covers the effects of various geometric configurations including joint thickness, perforation diameter, and mass distribution of the heat sink on the thermal performance under natural convective conditions. Key findings indicate that increased perforations enhance heat dissipation due to greater surface area, and hexagonal perforations outperform triangular and square shapes in thermal dissipation. An optimal perforation diameter of 0.8 cm balances between airflow resistance and contact surface area for effective heat transfer, while a joint thickness of 0.1 cm provides the best thermal dissipation, balancing between heat conduction and thermal management. However, bending the enclosure slightly impairs thermal management by increasing the maximum temperature and reducing airflow efficiency. Larger enclosure diameters improve thermal management by lowering temperatures and heat flux. Last but not least, an enclosure height of 1.8 cm offers optimal thermal management and benefits with minimal material cost. Overall, this study underscores the importance of optimizing enclosure geometry to enhance the thermal performance of high-power LED streetlights where it contributes to the more efficient and durable lighting solutions. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/22483 | |
| dc.language.iso | en | |
| dc.title | Thermal dissipation over high-power led enclosure | |
| dc.type | Resource Types::text::report::technical report | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |