Publication: Design of heat sink for electronic component using natural convection
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Date
2023-07-13
Authors
Mohamad Lutfie bin Mohamad Noor
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Abstract
Heat sinks are commonly employed to dissipate heat generated by electronic components and devices. An investigation focused on the design of heat sinks has prioritized thermal performance to achieve the lowest possible temperature for the components. The study employed experimental methods to compare and evaluate different heat sinks. The heat sink design was created using SolidWorks 2022 student edition software and subsequently fabricated using an end milling CNC machine with aluminum AA6061 as the material. In this experiment, the Biot number approach was employed to determine that all heat sinks can be classified as lumped systems. The results indicate that conduction plays a dominant role in the heat transfer within the heat sink itself, overshadowing the influence of convection. Another experiment utilizes a heating film as the source of heat. The heat sink surface with the largest area demonstrates superior thermal performance. Increasing the height of the heat sink or employing a more complex manipulation design can result in a larger surface area. In comparison to Heat Sink 1 (HS1), Heat Sink 2 has higher fins, while Heat Sink 3 (HS3)
with a sinusoidal wave design fins. The thermal performance of the system needs to consider factors such as buoyancy force and friction. In natural convection, heat transfer occurs through fluid motion induced by temperature differences. When a fluid, such as a gas or a liquid, is heated, it becomes less dense and rises due to buoyancy forces. As it rises, it displaces the cooler, denser fluid, which in turn sinks to replace the warmer fluid. HS2 show the best thermal performance due to its properties with highest surface area, followed by HS1 and HS3. Despite having a higher surface area compared to HS1, the sinusoidal design HS3 exhibits lower thermal performance due to its lower buoyancy force and higher friction. When considering another manipulation parameter, it was observed that the 90° orientation exhibited superior thermal performance compared to the 0° orientation. The study also included the presentation and analysis of the Nusselt number and Rayleigh number as relevant factors in the study.