Publication: Nanoindentation investigation on lead-free solder interconnection prepared by microwave hybrid fast joining approach
| datacite.subject.fos | oecd::Engineering and technology::Mechanical engineering | |
| dc.contributor.author | Nurul ‘Aidah Binti Abdul Rahman | |
| dc.date.accessioned | 2026-01-26T02:40:37Z | |
| dc.date.available | 2026-01-26T02:40:37Z | |
| dc.date.issued | 2023-07-01 | |
| dc.description.abstract | manufacturing was driven by concerns for human health and environmental impact. The reflow process utilized during soldering plays a significant role in the formation and growth of the intermetallic compound (IMC) layer, crucial for ensuring reliable solder and metal substrate connections. While microwave hybrid heating (MHH) presents a potential soldering approach, the long-term reliability of solder joints remains uncertain. To address this, a comparative study was conducted to examine the impact of reflow soldering (CR) and MHH on IMC morphology, thickness, and elemental composition analysis (EDX) in SAC305 solder. Additionally, the mechanical properties of SAC305, such as hardness and elastic modulus, were evaluated using nanoindentation. The obtained results were further supported by finite element modeling using ABAQUS software. SAC305 was reflowed using CR at 480s, while reflowed using MHH was at various reflow times: 50s, 100s, 150s, 200s, and 250s, at high operating power. The IMC structure exhibited a similar transformation from scallop-like to planar-like in both CR and MHH, occurring after 100s of reflow time for MHH. The mean IMC thickness for CR was 5.914 μm, while for MHH, it ranged from 4.206 μm (at 50s) to 20.34 μm (at 250s). EDX analysis revealed the presence of Cu6Sn5 in the IMC for both methods, with Cu3Sn IMC exclusively observed in SAC305 reflowed by MHH. Nanoindentation results indicated higher hardness for MHH compared to CR. The proposed finite element modeling demonstrated good agreement with experimental data, showcasing its capability to simulate the plastic deformation behavior during the indentation process. Therefore, MHH can serve as an alternative method, yielding similar mechanical properties to CR, while nanoindentation proves effective in determining SAC305 hardness and elastic modulus. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/23514 | |
| dc.language.iso | en | |
| dc.title | Nanoindentation investigation on lead-free solder interconnection prepared by microwave hybrid fast joining approach | |
| dc.type | Resource Types::text::report::research report | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |