Publication: Computer simulation on warpage problem of large-sized BGA during reflow process
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Date
2023-07-07
Authors
Lee, Woei Jie
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Abstract
Manufacturing of BGA faces warpage problems when going through reflow process, which scales up with increasing BGA size. On top of that, the reflow process for large BGA being studied could reach high temperatures, around 200-300°C, which highly increase the chances of warpage problems being observed. In this study, computer simulation is used to model the warpage observed in a large BGA, strengthened with a steel plate. In present study, the model of the BGA-steel plate structure is generated. In present study, the temperature contours of the large BGA during heating and cooling stages are generated. The heat loads from these contours are imported for deformation simulation. It was observed that increasing peak temperature would increase warpage observed. Lastly, the effect of additional physical supports at the edges of the BGA were studied. Results shown that these supports help decreasing warpage.