Publication: Thermal design of the electronic equipment enclosures by forced air cooling
| datacite.subject.fos | oecd::Engineering and technology::Mechanical engineering | |
| dc.contributor.author | Chong, Wen Hao | |
| dc.date.accessioned | 2026-01-14T08:48:30Z | |
| dc.date.available | 2026-01-14T08:48:30Z | |
| dc.date.issued | 2023-08-07 | |
| dc.description.abstract | This study was focused on the computational evaluation of the heat dissipation of a parallel plate heat sink by using Computational Fluid Dynamics (CFD). The software that has been used in the study is ANSYS Fluent 2022 R2. The parallel plate heat sink was made up of Aluminium-alloy 6063 and it is being subjected to the ambient conditions of 1.01 kPa and 25 ℃. In addition, a constant heat flux of 1200 W/m2 is applied at the bottom of the parallel plate heat sink, and the heat sink is forced to conduct forced air convection with an inlet air velocity of 1.1088 m/s (Re = 2130). Beside study the effect of geometry factor to the thermal performance of heat sink, the validation of simulation model also has been done by comparing the simulation results with the experiment results. To perform the validation, the simulation model used in this study is created based on the experiment model getting from a journal. Consequently, this simulation model was used for the study of effect of geometry factor to the thermal performance of heat sink. Next, the influences of the fin height and fin pitch on the thermal performance of the heat sink are studied by using a parametric study. The average Nusselt number is calculated by using the average temperature of the heat sink's bottom surface (also known as the heater surface), which is obtained from the results of the simulation. The results show that the heat sink with a larger fin height and smaller fin pitch has a better thermal performance. This study offers a thorough understanding of the relationship between fin height and fin pitch and heat sink thermal performance. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/23444 | |
| dc.language.iso | en | |
| dc.title | Thermal design of the electronic equipment enclosures by forced air cooling | |
| dc.type | Resource Types::text::report::technical report | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |