Publication: Dependency of filler loading on the epoxy underfill performance for electronic packaging application
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Date
2024-08-01
Authors
Phang Wei Jie
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Abstract
The performance of epoxy underfill in electronic packaging is dependent on the loading of fillers, which significantly impacts various properties essential by for the reliability and efficiency of electronic components. The aim of this project is to study the effect of filler loading on the flow rate, viscosity and thermal properties of epoxy underfill for electronic packaging application. The epoxy is mixed with the hardener, maleic anhydride and polyethylene glycol with the ratio of 1:1:1 and cured at 120 °C for 24 hours. The filler loading of fumed silica with nano sized was set at 0%, 1% and 2% which according to the total weight of the epoxy mixture. The uncured and cured epoxy underfill were studied in term of viscosity, flowrate, spectroscopic analysis, and thermal behaviour. The Fourier Transform Infrared (FTIR) analysis was conducted to compare the curing behaviour and chemical structure of uncured epoxy sample with cured epoxy sample. Meanwhile the Differential Scanning Calorimetry (DSC), Thermogravimetry Analysis (TGA), and Thermomechanical Analysis (TMA) were performed to investigate the thermal behaviour of epoxy underfill. It was found that, the viscosity of epoxy mixture increased with the increasing of fumed silica loading and in turn flow rate under glass slide decreased. It also found that the increasing fumed silica loading increased the thermal stability of epoxy and decrease the thermal expansion of epoxy which are important criteria for electronic packaging application. These findings suggest that while higher filler content may enhance certain thermal properties, it poses challenges for the electronic packaging application process due to reduced flowability.