Publication: Thermal simulation for silicone encapsulation of high power led
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Date
2008-04-01
Authors
Wong, Sook Yee
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Abstract
Silicone is preferred to use as encapsulants in HPLEDs (High Power Light Emitting Diodes) which have several advantages over the epoxy encapsulants. However, adding high current into the die will cause increasing of heat dissipation that will cause the failure on HPLED at the die and silicone encapsulant. Hence, thermal analyzes have been carried out in this investigation for a HPLED with 3 watts power and using silicone encapsulant. SolidWork software was used to model the HPLED package and ANSYS Workbench software which is based on finite element method was used to for the simulation. Results showed that the silicone has higher temperature than the die which was 217.15 °C and 105.46 °C respectively. The results obtain from simulation were approximately similar with the results that obtain by the referenced company through measurement. Besides, simulation on varies quantities of hot spots and its location inside the silicone encapsulant were done for comparison. Thermal and temperature distribution simulations on white HPLED with phosphor particles and phosphor layer forms have also done in this paper. Results showed that silicone encapsulant temperature decrease if more hot spots occur and vice versa. The silicone with phosphor layer form has lower temperature distribution than the phosphor in particle form.