Finite Element Analysis Of Bending Delamination In Multilayer Circuit Boards PCBs
Loading...
Date
2022-07-24
Authors
Zulkifli, Ahmad Fazlullah
Journal Title
Journal ISSN
Volume Title
Publisher
Universiti Sains Malaysia
Abstract
For decades, multilayer circuit boards have been often used in the electronic
industry, and their application in electronic devices has been crucial and rising in
recent years. It has the advantages of mobility, weight, and flexibility. Although the
analysis of delamination bending has long existed, almost the research made is likely
focusing on factor of temperature and pressure. Due to the importance of its
functionality, it is crucial to understand and predict the failure analysis of its
cohesive behaviour materials due to delamination bending. This paper is targeted to
predict the delamination bending load of multilayer composite printed circuit board
and to examine the effect of loading rate board stiffness on the crack path. From a
simulation cohesive zone model (CZM) using ABAQUS software, the best methods
of delamination modelling have been created to do analysis on the structure. This
method using cohesive-zone approach and traction separation to model the mix bond
made between cohesive prepreg and homogeneous material copper and substrate. In
other to test the bending delamination, simulation done by using three different
prepreg, difference PCBs stiffness and using impact load. The results showed that the
difference type of test have difference impact on delamination strength and fracture.
The structural analysis will be compared to get the best results. In conclusion, the
simulation can basically improve knowledge about PCBs delamination, measure the
force/load involved in PCBs and can compared the result in term of the stress field.
In future work, there is a need to make more include in the simulation to make sure
more flexible and best structure of PCBs.