The effect of temperature and rheology of solder paste during smt printing and reflow soldering process
| dc.contributor.author | Nina Amanina Binti Marji | |
| dc.date.accessioned | 2021-05-18T06:33:03Z | |
| dc.date.available | 2021-05-18T06:33:03Z | |
| dc.date.issued | 2017-06 | |
| dc.description.abstract | The presence of defects such as solder bump, bridging effect, tombstoning and poor wetting are the common failures in Surface Mount Technology. Two experiments which are SMT Printing and reflow soldering are built and tested to study the effect of temperature and rheology of solder pastes in SMT laboratory, thus finding the main source of the defects. In this study, the microstructures of solder paste on PCB and copper substrate are inspected under Scanning Electron Microscopy (SEM). It is focused on three parameters that affect the performance of PCB, which includes (1) the filling areas of solder paste (2) the distance between BGA (3) defects detected after reflow process. In particular, the filling area decreases as the temperature increases during SMT printing process. On the other hand, SAC307 on copper substrate after reflow soldering shows the smallest area and distance compared to other solder pastes. Lastly, SnPb possessed the most defects after reflow process which is solder bridging of the paste. | en_US |
| dc.identifier.uri | http://hdl.handle.net/123456789/13483 | |
| dc.language.iso | en | en_US |
| dc.title | The effect of temperature and rheology of solder paste during smt printing and reflow soldering process | en_US |
| dc.type | Other | en_US |
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