Experimental And Correlated Studies On Thermal Conductivity Of Beryllium Oxide Particles Filled Polymer As Thermal Interface Material For Dynamic Heat Flow In Leds Package

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dc.contributor.authorMohd Fauzi, Nabihah
dc.date.accessioned2021-02-01T01:50:57Z
dc.date.available2021-02-01T01:50:57Z
dc.date.issued2019-08
dc.description.abstractBeO nanoparticles were synthesized by polyacrylamide gel route with varied calcination temperature; 800, 900 and 1000 0C. Structural characterization and surface morphology between synthesized BeO nanoparticles and commercial BeO microparticles were analyzed by X-ray diffraction analysis (XRD) and Scanning electron microscope analysis (SEM) in order to study the crystallinity and structural properties as well as surface morphology of BeO particles that would be beneficial for filler application. Thermal conductivity measurement analysis was carried out on both synthesized (800 0C) and commercial BeO particles filled epoxy matrix in order to figure out the effect of particle size on the thermal conductivity of epoxy composites. The structural properties and surface morphology that yielded the best crystallinity quality for BeO particles as well as the optimum size which enhanced the thermal conductivity of filled epoxy composites were observed at commercial BeO microparticles. BeO particles filled epoxy composite has been prepared with varied filler loading (10, 30 and 50 wt%) by mixing using the mechanical stirrer. Then, X-ray diffraction analysis (XRD), dynamic mechanical analysis (DMA) and Thermo-mechanical analysis (TMA) were carried out in order to study the crystallinity, thermal and mechanical properties of the composites.en_US
dc.identifier.urihttp://hdl.handle.net/123456789/11099
dc.language.isoenen_US
dc.publisherUniversiti Sains Malaysiaen_US
dc.subjectThermal Conductivityen_US
dc.subjectBeryllium Oxideen_US
dc.titleExperimental And Correlated Studies On Thermal Conductivity Of Beryllium Oxide Particles Filled Polymer As Thermal Interface Material For Dynamic Heat Flow In Leds Packageen_US
dc.typeThesisen_US
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