Computational methods in flipchip assembly.

Simple item page
dc.contributor.authorHj Abdul Azid, Ishak
dc.date.accessioned2017-09-12T07:11:14Z
dc.date.available2017-09-12T07:11:14Z
dc.date.issued2002
dc.description.abstractFlip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive "bumps" placed directly in between the die surface and the substrate. Therefore, the whole chip surface can be utilized for active interconnections and at the same time, eliminates the need for wire bonding.en_US
dc.identifier.urihttp://hdl.handle.net/123456789/4619
dc.subjectComputationalen_US
dc.subjectFlipChipen_US
dc.subjectAssemblyen_US
dc.titleComputational methods in flipchip assembly.en_US
dc.typeTechnical Reporten_US
Files
License bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description:
Download
Collections
Institut Penyelidikan dan Teknologi Nano Optoelektronik (INOR) - Geran Penyelidikan