Thermoforming process study of stretchable electronic circuit
| dc.contributor.author | Mohd Fahmy Bin Rosli | |
| dc.date.accessioned | 2021-05-18T06:47:19Z | |
| dc.date.available | 2021-05-18T06:47:19Z | |
| dc.date.issued | 2017-06 | |
| dc.description.abstract | Thermoforming is a manufacturing process where a plastic sheet is heated to forming temperature and formed to a specific shape in a mold, then trimmed to create a usable product. A wide range of application from plastic toys, cafeteria trays to aircraft windscreens can be perform or produce by thermoforming technique. Low cost equipment is the main reason thermoforming process used. The main objective of this project is to study the development of the thermoforming process, then this process is simulated by using ANSYS Polyflow simulation. Distribution of the film thickness is the most important decision in the process of thermoforming. Film thickness distribution results are then compared to the results of the strain to see the relationship between the thickness and stretching area. Subsequently, the grid test was also conducted to see area stretch and deformation grid. A comparison is made for experimental and simulation works. From the result, simulation result is matched with the experimental result. So, the simulation setup has proven to be correct. In conclusion, understanding and technique of Thermoforming process development has been fully developed. | en_US |
| dc.identifier.uri | http://hdl.handle.net/123456789/13488 | |
| dc.language.iso | en | en_US |
| dc.title | Thermoforming process study of stretchable electronic circuit | en_US |
| dc.type | Other | en_US |
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