Numerical analysis of ultra-fine package assembly with sac305-tio2 nano-reinforced lead free solder at different peak temperature
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Date
2018-05
Authors
Asyraf Hasif Aziz
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Abstract
This thesis aims to determine the effect of peak temperature on the wetting region of
ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly
and to investigate thermal strain on the intermetallic compound (IMC) layer. This study focuses
on the nanoparticles distributions, fillet height and thermal strain of the IMC layer. Various
weight percentages of the nanoparticles TiO2 with the SAC305 lead free reinforced solder and
different peak temperature will be used. The main aim of this project is to obtain all the
particles distributions, fillet height, thermal strain through the use of Ansys Workbench 18.2.
The results obtained are validated by the experimental result obtained using high-resolution
transmission electron microscope system equipped with an energy dispersive X-ray
spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS
and X-ray diffraction machine. The findings on this study shows that for higher temperature
of the wetting region that ranges between 240°C and 255°C gives better particles distributions.
Additionally, fillet height of the solder within this temperature range meet the requirement of
the IPC standards that state that the measurement of the fillet formation for the joining of the
device to the PCB pad should adhere to solder thickness of +25% of the termination height
which is 0.0889mm. The best fillet height obtained is 0.1408988mm from using 250°C. The
maximum thermal strain that exerted on the IMC layer recorded is from the sample of 255°C.