Investigation on structural and thermal performance of go filled epoxy composite as thermal interface materials for LED application
| dc.contributor.author | Khishn Kumar A/L Kandiah | |
| dc.date.accessioned | 2021-02-15T02:58:47Z | |
| dc.date.available | 2021-02-15T02:58:47Z | |
| dc.date.issued | 2019-05 | |
| dc.description.abstract | In recent years, the development of light emitting diode (LED) shown that it is a powerful device in the field of solid-state lighting due to their significant advantages over the conventional light sources which is used in variety of applications. However, LED requires effective heat dissipation has emerged as the most crucial process for operational lifetime and reliability of the entire system. Thermal interface material (TIM) is the best way to solve the heat dissipation problems in LEDs. The main purpose of this study is to synthesize graphene oxide (GO) via modified Hummer’s method which is used as a filler material to form thermally conductive polymer. The oxidation of graphene was confirmed using Fouriertransform infrared (FTIR), X-Ray Diffraction (XRD) and Field Emission Scanning Electron Microscopy (FESEM) techniques. The nanocomposite of Epoxy/GO were fabricated using GO with different loading of 0.4wt%, 0.8wt% and 1.2wt%. The structural and thermal properties of Epoxy/GO nanocomposite with different filler loading were investigated by conducting FESEM, FTIR, thermal conductivity test, thermal imaging and thermal transient measurement. The thermal conductivity in E/0.4GO showed 32.24% increment as compared to pristine epoxy. Besides, the E/0.8GO showed the lowest thermal resistivity and junction temperature at three different driving current as 300mA, 500mA and 700mA. | en_US |
| dc.identifier.uri | http://hdl.handle.net/123456789/11254 | |
| dc.language.iso | en | en_US |
| dc.title | Investigation on structural and thermal performance of go filled epoxy composite as thermal interface materials for LED application | en_US |
| dc.type | Other | en_US |
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