Application of design of experiment (DOE) in printed circuit board assembly (PCBA) industry

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dc.contributor.authorVaithilingam, Mathaeswari
dc.date.accessioned2016-11-03T00:54:43Z
dc.date.available2016-11-03T00:54:43Z
dc.date.issued2005-03
dc.description.abstractPrinted circuit board assembly (PCBA) is a process of mounting and inserting components to printed circuit board (PCB) by means of several principle processes such as Manual Insertion, Auto Insertion (Axial & Radial), Wave Soldering, Surface Mount Technology and Box Build. Manufacturers of PCBA are forced to produce better quality with less cost in order to stay in the business as globalization taking shape. To achieve such a goal, manufacturers are forced to strive to attain and maintain high first pass-yield. Hence, Design of Experiments (DOE) is one of the statistical tools that can be used by the manufacturers of PCBA to purposefully evaluate and optimize designs and processes; so that the manufacturers can achieve greater first pass yield and lower wastage which attributes to decrease the product cost. A project was implemented in a PCBA manufacturing company using the Full Factorial Design with two levels for the wave sold~g process with the aid of MINIT AB Software. And the objectives of the experiment were to: determine the key factors of the process and optimize the process for higher yield. The results of the experiments were marvelous, the yield at the wave soldering increased 90.6 to 97.4. At the same time the key factors were identified and monitored closely to minimize variations.en_US
dc.identifier.urihttp://hdl.handle.net/123456789/2968
dc.subjectManufacturers of PCBA are forced to produce better quality with less costen_US
dc.subjectin order to stay in the businessen_US
dc.titleApplication of design of experiment (DOE) in printed circuit board assembly (PCBA) industryen_US
dc.typeThesisen_US
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