Numerical study on light emitting diode encapsulation process
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Date
2019-05
Authors
Amirah Aisyah Binti Tan Halid
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Abstract
Development of innovative product in electronic industry in toward miniature and faster products with excellent performance, lighter package and more economical. Integrated circuit can be used to support multi-LED with various function to connect with electronic systems packaged. The space between cover lens and the LED chip is filled with a polymeric materials which usually can be epoxy or transparent silicone encapsulant that behave as non-conductive material. Encapsulation purpose used to protect the device from mechanical effect that might affect the strength of connection between the chip and substrate. This research is focusing on the simulation of filling of silicone encapsulation process by using CFD simulation. The study of four different injection velocity behavior affected the dispensing application depending rheology models. In addition to that, the effect of three different encapsulant material with different viscosity have been studied. Further studies have been made for four different injection pressure compatible with the process. ANSYS FLUENT software on handling polymer filling process has been performed by comparing previous research works on LED encapsulation process. The numerical results showed good agreement with the simulation results for suitable injection velocity. The filling volume tend to be over filling as the viscosity increases. Furthermore, the injection pressure significantly influence the filling time and reliability. Simulation results showed that the better section of injection pressure gives better filling during dispensing process.