Effect of temperature on flexible printed circuit board during reflow soldering process
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Date
2018-05
Authors
Muhammad Rafiq Mohammad Sabri
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Abstract
High demands on flexibility, lighter weight, thinner size and low cost electronic
product had increases the application of Flexible Printed Circuit Board (FPCB) over
Rigid Printed Circuit Board (RPCB). However, thermal factor affects significantly on
FPCB during reflow soldering process. Temperature of reflow soldering process cause
FPCB to encounter significant deflection and thermal stress compared to the RPCB.
Therefore, the present experiment aims to investigate the effect of temperature on FPCB
during reflow soldering process. The deformation of RPCB and FPCB were measured
by using KEYENCE LK-G152 laser sensor placed at the entrance and outlet of reflow
oven. Two temperature profile were used as variable for the experiment which is
soaking temperature profile and ramp temperature profile. The result shows FPCB had
low deformation with ramp temperature profile while RPCB had low deformation with
soaking temperature profile. However, the deformation of FPCB is higher compared to
RPCB for both temperature profile. Different in material composition of FPCB and
RPCB cause the RPCB and FPCB have different preferable temperature profile. The
experiment also shows that component placements pattern influences the deformation
of FPCB and RPCB. For both FPCB and RPCB, component placements reduce
deformation due to low wetting angle and component weight. For solder joint, FPCB
solder joint has good wetting angle (<90°) which is indicate good solder paste deposited
on the FPCB. However, several solder joints on FPCB are irregular in shape due to
high deformation. Therefore, it is important to study the effect of temperature on FPCB
during reflow soldering process for industries guideline for mass production of FPCB
products.