Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process
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Date
2022-07-24
Authors
Raja Gobal, Hehgeraj
Journal Title
Journal ISSN
Volume Title
Publisher
Universiti Sains Malaysia
Abstract
A typical element found in electronic assemblies and devices is the multi-layered ceramic capacitor (MLCC). However, MLCC mechanical defects such as
voiding, cracking, and delamination would significantly reduce the device's
usefulness, dependability, and longevity. This mechanical defect is one of the
significant factors that will develop in the surface mount of the multi-layered ceramic
capacitor, especially the layer between the two different materials that are mounted
together. Therefore, the purpose of this study is to study the crack propagation that will
be found in the boundary of the copper and copper-epoxy layers of the multi-layered
ceramic capacitor during the reflow soldering process. The numerical simulation
method for the thermal reflow process of the MLCC model and the crack propagation
from the initial micro voids due to the high moisture contamination on that layer was
approached. Besides, the temperature flow and the moisture contamination on the
copper and copper-epoxy layers were examined during the simulation for the causes
of the crack propagation on the MLCC. From the results of the simulation conducted,
the crack propagation in between the copper and copper-epoxy layers was caused by
the thermal mismatch and propagation growth of micro voids during the reflow
soldering process. As a result of the high pressure of vapour absorbed in the gap
between the copper and copper-epoxy layer, it will have a greater capacity to absorb
moisture and cause crack delamination, resulting in the higher temperatures required
to commence the crack at 270 °C during the reflow process. At 284.2 (mg/mm3), the
concentration is at its highest. Because of this, a multi-layered ceramic capacitor results
in a 0.077218 mm deformation between copper and copper-epoxy. Higher vicinity
stress, mode I stress intensity factor, and crack elongation rate would result from this
greater void. The main reason for the temperature reflows that is related to the fracture
propagation problems in capacitors has been identified, and workable solutions have
thus been suggested. This would help the end-users by enhancing the performance and
dependability of the electronic equipment, as well as minimizing the additional
manufacturing costs and lead times required in locating and resolving the problems.