Computational Methods in FlipChip Assembly
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Date
2002
Authors
Hj Abdul Azid, Prof. Dr Ishak
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Abstract
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Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip
to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate.
By flipping over the chip, the interconnection between the chip and the substrate are achieved by
conductive "bumps" placed directly in between the die surface and the substrate. Therefore, the
whole chip surface can be utilized for active interconnections and at the same time, eliminates
the need for wire bonding.
An internet source, (FlipChips Dot Com, 2001) indicates that flip chip interconnection
has been introduced since the early sixties by IBM for use in their mainframe computers and
IBM has continued to use flip chip up to the present day. The same source also acknowledges the
role played by Delco Electronics in helping to develop flip chip for automotive applications in
the seventies. These early developments together with the advantages of flip chip packaging
technology which offers smaller chip size, higher I/O density with area array, better electrical
performance and lowest cost interconnection for high volume automated production results in
flip chip packaging being considered as the preferred choice over other conventional wafer level
packaging technology (Meilhon et aI., 2003).
There are essentially three basic elements in the solder flip chip interconnect systems
(Fig. 1.1). These include the chip, the solder bump, and the substrate. The solder bumps in a flip
chip interconnect system has three functions. First, the solder joint forms the electrical
connection between the chip and the substrate. Second the solder joint also serve as a path for
heat dissipation from the chip.
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Mechanical Engineering