Production and characterization of AG-CU nanopaste for high temperature application
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Date
2016-06
Authors
Nur Aminaton Sufia Yuharmon
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Abstract
As the demand of electronic devices that could operate at high temperature, in particular power devices, is increasing over the years; robustness of die-attach material as one of the important electronic packaging materials has become a critical issue. The reduction of size from micro has been improved to the nano sized and hybrid sized. The reduction of size is aims to reduce the formation of stress among the die, die-attach and substrate in an operating power device. Before Ag-Al, Au was used. Then, Ag-Al has been used in year 2012 because of its good performance at high temperature. However when compared Ag-Cu with Ag-Al, Ag-Cu reveals a better performance due to the properties of Cu. The effect of different size of silver (Ag); (i) 50-60 nm and 20-50 nm, (ii) 150 nm and 50-60 nm and (iii) 150 nm and 20-50 nm combined with same size of copper (Cu) which is 50-60 nm, on the microstructure and properties of the Ag-Cu die-attach nanopaste were studied in this project. The characterization that have been done were physical and electrical properties. For physical properties testing are atomic force microscopy (AFM), field-emission scanning electron microscopy (FE-SEM), energy dispersive x-ray (EDX) and X-ray diffraction (XRD) while electrical properties testing is four point probe measurement resistivity. Based on the result, the porosity decreased when the larger size of Ag combined with smaller size of Ag then mixture with Cu particles that constant in size and the electrical conductivity increased due to the lesser amount of pores. Thus, the result obtained reveals that 150 nm and 20-50 nm size of Ag combined with 50-60 nm of Cu which was Set 3 shows the best achievement due to the better properties which were consist of less porosities, uniform distribution and good electrical conductivity.