The study of filling time in underfill encapsulation of different ball grid array packaging using particle image velocimetry and finite volume method

dc.contributor.author	Mohd Hafiz Bin Abdul Satar
dc.date.accessioned	2021-05-18T06:42:41Z
dc.date.available	2021-05-18T06:42:41Z
dc.date.issued	2017-06
dc.description.abstract	A ball grid array (BGA) package may described as a type of surface-mount packaging used in integrated circuit (IC). It has gain industry interest as it provides high input and output connection and more reliable. Yet, it subjected to drawbacks such as extended filling time, incomplete filling and void formation. Thus, the project is to studies the drawbacks and will involve the experimental and numerical approach of three different shapes of ball grid array (BGA) in underfill encapsulation process. A physical model is also prepared and study using particle image velocimetry (PIV) to obtain experimental results. Whereas, for numerical approach, the finite volume method (FVM) has been applied based on the algebraic equation. The result show that the hourglass BGA has lowest filling time and lesser tendency to has void formation compared to other shape. Nevertheless, both method have comparable results and good agreement.	en_US
dc.identifier.uri	http://hdl.handle.net/123456789/13486
dc.language.iso	en	en_US
dc.title	The study of filling time in underfill encapsulation of different ball grid array packaging using particle image velocimetry and finite volume method	en_US
dc.type	Other	en_US

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