Experimental and numerical investigation of two PLCC inline horizontal mounted
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Date
2009
Authors
Yusoff, Sharupuddin
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Abstract
Study of heat transfer on the semiconductor is essential in order to make sure lifespan, reliability and performance of semiconductor are on the top. Generally, heat transfer coefficient can be improved by natural convection and force convection. Heat sinks are popular tool that remove heat from semiconductor. Gaps also can affect on heat. In this study, the effect of four differences PLCC gaps in 0 cm, 1.5 cm, 3.0 cm and 4.0 cm and seven differences Reynolds number in the range of 2.67 x 103 to 9.06 x 103 . Nusselt number and thermal resistance were investigated. Two tandem PLCCs mounted on the platform were investigated by experimental and simulation. The simulation has been done by Fluent software, however, experiment has been conducted by air chamber. The results show that the Reynolds number is proportional with Nusselt number and heat transfer coefficient. Moreover, PLCC gaps increase with Nusselt number but decrease a thermal resistance. Simulation results higher than experimental results and PLCC 1 produce lower temperature compare with PLCC 2. Finding from the research showed that the PLCC 3.0cm gap produced the lowest thermal resistance between 2.4 W/°C and 3.6 W/°C for PLCC 1 and PLCC 2 respectively for Reynolds number 9.06 x 103 and PLCC 0.25 W power. The highest thermal resistance for PLCC 1 and PLCC 2 each with 22 W/°C and 23.4 W/°C is produced by 2.0W power. The maximum difference between experimental results and simulation is 12 %.
Description
Master
Keywords
Science Physic , PLCC inline