Heat Dissipation Enhancement Using Graphene Heat Sink
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Date
2021-07-01
Authors
Wong, Jer Jian
Journal Title
Journal ISSN
Volume Title
Publisher
Universiti Sains Malaysia
Abstract
Heat dissipation is one of the challenges that need to be tackled to enhance the
performance of the electronic components. In current study, the numerical
investigation on the use of graphene in designing a plate fin heat sink and evaluation
of thermal performance by comparing with the conventional material (copper and
aluminium alloy) are performed. In particular, the effects of fin height, heat flux and
flow rate of the working fluid on the thermal performance of the heat sink are studied
and documented in the thesis. The thermal performance is evaluated in terms of the
thermal resistance, average Nusselt number, pumping power required and fin
efficiency of the heat sink. This study has shown that the graphene heat sink which has
a higher thermal conductivity yields the lowest thermal resistance and gives the highest
average Nusselt number among other materials. The pumping power required for the
flow of working fluid is independent to the material used. With its high intrinsic
thermal conductivity, graphene heat sink reduced the drop in terms of fin efficiency
when fin height is increased, the percentage of the fin efficiency drop with the height
is not more than 2% in the study.