Design and fabrication of semi-auto wafer scriber for 4-in and 8-in wafers
Loading...
Date
2018-06
Authors
Illma Laili Yasmin Tarmizi
Journal Title
Journal ISSN
Volume Title
Publisher
Abstract
High demanding in semiconductor on wafer make fabrication of wafer keep increase years by
years. Before a semiconductor device can be built, silicon must turn into a wafer which begins
the growth of silicon ingot. Polysilicon crystal that formed by many small single crystals came
with different orientations which required functionality which involves different steps during
manufacturing. Orientation is known as line/direction when silicon wafers are slice from crystal.
Die separation of thin silicon wafers and delicate substrates creates challenges for traditional saw
dicing. Scribe and break die separation is an alternative to saw dicing. The feature of scribe need
beneficial with thin silicon wafers which is hard and brittle material. To break the wafer, a scribe
line must be created in the wafer surface where the break is desired. There are many type of
diameter of wafer. This prototype is cover for 4 inch and 8 inch diameter of wafers. Design of
wafer scriber being done by considering some parameter which is material, functional of every
parts and machining process. Fabrication of prototype is done by considering design and
machining processes. A sample of scriber is chosen for analyzing result of line scribe using
scanning electron microscopy technique (SEM). The sample is analyzed by comparing width of
line scribe with tip diameter of scriber. Results of scribe line does not have much different with
diameter of tip and there is no crack happened on scribe line.