Experiment and simulation reflow process of pdms material
Loading...
Date
2017-06
Authors
Go, How Chiang
Journal Title
Journal ISSN
Volume Title
Publisher
Abstract
Electronic packaging plays a very crucial role in an electronic industry. Evolution of electric components happens from non-stretchable to stretchable electronics. PDMS is commonly used in producing stretchable electronics. However, solder made from PDMS has weaker electric conductivity while stretched. This happens to be the interconnectivity among the filler material (Silver) inside the solder is not established well. Due to previous failure in interconnectivity among silver powder, silver flakes are simulated to study the distribution inside the solder. The filler material is treated as particles to run simulation for interaction between VOF and DPM. Different weight percentages of silver filler are selected for simulation. The weight percentages seems to have effect on the distribution, wetting time, velocity and pressure. The wetting time tends to prolong with higher silver percentages. Velocity and pressure distribution shows similar trend for different weight percentages of silver fillers but they are not evenly distributed within the solder. The velocity and pressure decreases as the weight percentage of the silver increases. The distribution of the silver flakes are shown and verified with an experiment and the silver particles tend to accumulate at the upper region of the solder. The experimental and simulation model shows a good agreement. The silver filler tends to accumulate at the top of the solder regardless the silver weight percentages. The trajectories of the particles are also studied to determine possible voids formation in the PDMS solder. There are more trajectories as the silver weight percentage increases which in turn will increase the probability of void formation within the solder material.