Structural Integrity Investigation Of SAC305 Lead Free Solder
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Date
2022-07-24
Authors
Ganiashan, Eesvaran
Journal Title
Journal ISSN
Volume Title
Publisher
Universiti Sains Malaysia
Abstract
Improvement in solder strength is instantly becoming one of the most important
concerns in the electronics industry, particularly in Printed Circuit Board (PCB)
applications. Because of the design and mounting of electronic components on a substrate
or PCB, solder in electronic connections may crack and deform to certain factors. These
causes device failures and massive costs, and the true impact of crack caused losses in the
industrial sector is not widely communicated. As a result, mechanical strength of solder is
now one of the most complicated issues, and it has received increased attention in recent
years as a result of increased product warranties, advanced technologies, and phase changes
brought about by recent laws affecting the electronics sector. In addition, a delicate and
unstudied characteristic of SAC305 solder on copper was limited. Therefore, this project
was conducted to study the mechanical properties of SAC305 solder. The reflowed
SAC305/Cu solder with the temperature of 220℃ at 60 seconds was investigated. The
microstructure, structural phase, and hardness of the formed intermetallic compounds were
investigated. The interfacial IMC formed between SAC305 and the Cu substrate after
solder reflow is Cu6Sn5 and Ag3Sn. The IMCs where visible in SEM and detected in XRD.
The effect of IMCs in the terms of hardness was investigated using Vickers hardness test
and nanoindentation. A specific indentation array was performed on four different
horizontal cross sections of the solder with different heights and diameters. The hardness
values increased gradually from the top cross sections towards adjacent to the
solder/substrate interface.