Effect Of Epoxy Materials And Gold Wire Number On Led Encapsulation Process
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Date
2022-07-24
Authors
Zubir, Muhammad Syukri
Journal Title
Journal ISSN
Volume Title
Publisher
Universiti Sains Malaysia
Abstract
There are several issues concerning high-power LED application that affect the
functionality and reliability of the LED. The most common problems that occurred in
LED during the encapsulation process is wire deformation which can affect the life
expectancy of the LED. The aim of this present study is to analyse the influence of
different epoxy materials and effect of gold wire numbers during the LED encapsulation
process. In this study, ANSYS Fluent is utilized to simulate the volume of the epoxy
materials being dispense onto the LED by utilizing the volume of fluid (VOF) strategy
and user-defined function (UDF). Besides, ANSYS Fluent is also utilized to complete
an investigation on the fluid-structure interaction (FSI) phenomena between the gold
wire bonding and the epoxy materials. The FSI modelling was used to measure the
amount of stresses indirectly applied to the gold wire bonding during the encapsulation
process. The simulation is conducted by varying the types of epoxy materials (ERL 4221, EMC and D.E.R.-331) and number of gold wires (1,2,3,4 and 5). An experimental
test was conducted to validate the final structure of the epoxy materials obtained from
the simulation setup. The results obtained show that the wire deformation, stress and
strain distributed on the wire bonding increased with the increasing density of epoxy
materials. Besides, the simulation results on the different gold wire numbers showed
that the higher the number of gold wires, the larger the stress and strain distributions
when the same epoxy material is used.