Soldering characteristics and corrosion behaviour of indium added to sac305 solder alloy
Loading...
Date
2018-06
Authors
Atikah Zulaikha Amiruddin
Journal Title
Journal ISSN
Volume Title
Publisher
Abstract
Alloying element indium is chosen in order to study the effects of indium to
corrosion resistance of Sn-Ag-Cu solder alloy. In this project, the composition of indium
was varied ranging from 1-4 wt. % and were added into Sn–3.0Ag-0.5Cu solder. The
effects of indium addition on melting property, microstructure, corrosion resistance,
wettability of the solder alloys were studied. For thermal properties, it can be determined
that more addition of indium lowered the melting point of SAC305 solder alloy as the
melting temperature is reduced from 229.55 ○C to 219.91 ○C. For morphological analysis
of bulk sample of solder alloy, it can be determined that 1 wt. % of In addition to the
solder alloy composition is already adequate as fine grain and uniformly distributed
microstructure can be obtained. Fine grain size acquired due to 1 wt. % of In addition to
solder alloy lead to greater spreading area with 6.18 mm and lower wetting angle with
14.59○ which resulted in good wettability of solder alloy. In addition, based on the data
acquired from plotted polarization curve corrosion rate analysis, it can be determined that
the addition of 1 wt.% of In gives the lowest corrosion rate and high corrosion resistance
compared to other prepared of solder alloys. Thus, it can be concluded that a mere amount
of 1 wt. % of In addition to the solder alloy composition is already adequate in order to
achieve desired properties like fine grain and uniformly distributed microstructure, good
wettability, low thermal properties and good corrosion for SAC305 solder alloy.