Pusat Pengajian Kejuruteraan Mekanikal - Monograf
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- PublicationA study of thermal cooling solution for storage device(2023-07-01)Ahmad Syauqi bin OsmanA storage device is used in a computer or laptop to store the memory or to be the core of the computer. Over time, the storage device or frequently known as a chip can overheat thereby harming the entire components. To cool down the temperature, a cooling system needs to be used to ensure that the heat can be dispersed uniformly into the surroundings. A heat sink is used in this study as the thermal cooling solution that can dissipate heat from the chip hence cooling down the temperature of the chip. In this study, a Finite Volume Method (FVM) simulation from ANSYS Fluent will be utilized for the simulation of junction temperature reduction of the chip and the heat dispersion to the surroundings. Several parameters were used to improve heat dissipation in this simulation for example, the base area of the heat sink, the thickness of the base area, the number of fins, the height of the fins and the shape design of the heat sink. A temperature of 51.35ᵒC was recorded for the largest area of 50x50mm² while for the thickness of the base of 15mm, the resulting value would be 58.85ᵒC. For different variation of fins, 6 fins configuration for the heat exchanges recorded to have a temperature drop of 75.85ᵒC while for the height of fins of 50mm shows a drop in temperature by up to 49.46ᵒC. For the different shapes of the heat sink design, parallel and pin fin shapes recorded almost similar temperatures of 55.56ᵒC and 55.59ᵒC respectively. The lowest possible temperature will reach is up to 48.72ᵒC. This can accomplish the 50ᵒC handling chip comfortably requirement by combining the base thickness of 5mm, the heat sink's area of 30x30mm², the fin's height of 8mm with the thickness of 1mm for each fin, and the presence of 7 total fins.