Publication: Properties of epoxy composite for solder mask application: effect of inorganic fillers and hyperbranched polyester polyol
| datacite.subject.fos | oecd::Engineering and technology::Materials engineering::Materials engineering | |
| dc.contributor.author | William, Lim Yung Ling | |
| dc.date.accessioned | 2025-12-03T02:45:53Z | |
| dc.date.available | 2025-12-03T02:45:53Z | |
| dc.date.issued | 2024-08-01 | |
| dc.description.abstract | High packing density of electronic components in printed circuit boards (PCBs) inevitably raised the risk of thermo-mechanical damages during PCB assembly process. As solder mask (SM) is the PCB’s outermost layer, thermal and mechanical properties of SM become increasingly vital. This study aims to improve the properties of SM by investigating the addition of inorganic fillers, hyperbranched polyester polyol (HBP-OH) toughening agent and silane coupling agents. Firstly, commercial SM was characterized and the results were used as benchmarking for comparison. In this study, different types and loadings of fillers (talc, BaSO4, SiO2 and BN at 5 and 15 wt%), HBP-OH toughening agent (10-40 wt%) and silane coupling agent (APTES and GPTMS at 3, 5 and 10 wt%) were mixed with epoxy using ultrasonication method. The samples were characterized based on tensile and thermal properties as well as pull off strength. Results unveiled that the commercial SM consists of BaSO4 filler and epoxy acrylate. Among different filler types, 15 wt% SiO2-filled epoxy showed higher tensile strength and modulus, storage modulus and glass transition temperature (Tg) with improvement of 11.6%, 16.2%, 8.8% and 1.7 ˚ C, respectively, compared to neat epoxy. Inclusion of 20 wt% HBP-OH into 15 wt% SiO2/epoxy results in enhancements of elongation at break (EB) and thermal decomposition temperature (Td). Among silane-added composites, the addition of 5 wt% APTES showed the best tensile strength and modulus, EB, and pull off strength, increasing by 5.58 MPa, 0.98 GPa, 0.235%, and 43.4%, respectively, compared to untreated sample. Overall, 5 wt% APTES/20HBP-OH/15SiO2/epoxy composite is the most recommended composition for SM application due to their superior tensile properties and pull off strength. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/23302 | |
| dc.language.iso | en | |
| dc.title | Properties of epoxy composite for solder mask application: effect of inorganic fillers and hyperbranched polyester polyol | |
| dc.type | Resource Types::text::thesis::master thesis | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |