Publication: Cfd application in cooling of three dimensional single package using forced convection
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Date
2002-03-01
Authors
Ravinder Singh, Jangir Singh
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Abstract
Most of the failures in electronic packaging are due to the thermal affects.
Therefore the cooling of the electronics packaging is very important to ensure the
package performance and reliability. In this project a single 84-pin PLCC package is
mounted on a printed circuit board (PCB) in a wind tunnel is simulated using the CFD
tool namely Fluent. The modeling and meshing are done in Gambit and the solver
parameters are defined later in Fluent. An unstructured grid is used for the meshing of
this model. The fluid that is used for the simulation is air. A number of simulations are
done using different input values. This model is simulated under different values of
heat input, ambient temperatures and air velocities. For each of the cases the
temperature distribution, temperature profile and the average heat transfer coefficient
profile along the package are obtained.
When the heat input is increase the maximum junction temperature and the
average heat transfer coefficient will also increase. A decrease in the ambient
temperature will result the maximum junction temperature to be lower than before. But
the average heat transfer coefficient for this case will increase sharply. With higher air
velocities the maximum junction temperatures reduces. This will cause an increase in
the average heat transfer coefficient. The velocity boundary layer tends to be more
smaller with higher air velocities. The present of the hot spot seems to be more
widespread with lower air velocity. This hot spot will get smaller when the air
velocities are increased.