Publication: Cfd application in cooling of three dimensional single package using forced convection
| datacite.subject.fos | oecd::Engineering and technology::Mechanical engineering | |
| dc.contributor.author | Ravinder Singh, Jangir Singh | |
| dc.date.accessioned | 2024-09-23T04:45:26Z | |
| dc.date.available | 2024-09-23T04:45:26Z | |
| dc.date.issued | 2002-03-01 | |
| dc.description.abstract | Most of the failures in electronic packaging are due to the thermal affects. Therefore the cooling of the electronics packaging is very important to ensure the package performance and reliability. In this project a single 84-pin PLCC package is mounted on a printed circuit board (PCB) in a wind tunnel is simulated using the CFD tool namely Fluent. The modeling and meshing are done in Gambit and the solver parameters are defined later in Fluent. An unstructured grid is used for the meshing of this model. The fluid that is used for the simulation is air. A number of simulations are done using different input values. This model is simulated under different values of heat input, ambient temperatures and air velocities. For each of the cases the temperature distribution, temperature profile and the average heat transfer coefficient profile along the package are obtained. When the heat input is increase the maximum junction temperature and the average heat transfer coefficient will also increase. A decrease in the ambient temperature will result the maximum junction temperature to be lower than before. But the average heat transfer coefficient for this case will increase sharply. With higher air velocities the maximum junction temperatures reduces. This will cause an increase in the average heat transfer coefficient. The velocity boundary layer tends to be more smaller with higher air velocities. The present of the hot spot seems to be more widespread with lower air velocity. This hot spot will get smaller when the air velocities are increased. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/20525 | |
| dc.language.iso | en | |
| dc.title | Cfd application in cooling of three dimensional single package using forced convection | |
| dc.type | Resource Types::text::report | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |