Publication:
Modeling and simulation of thermal microactuator

datacite.subject.fosoecd::Engineering and technology::Electrical engineering, Electronic engineering, Information engineering::Electrical and electronic engineering
dc.contributor.authorAng, Beng Seng
dc.date.accessioned2024-07-29T01:40:05Z
dc.date.available2024-07-29T01:40:05Z
dc.date.issued2009-04-01
dc.description.abstractThis thesis focuses on the modeling and simulation of a thermal bimorph microactuator. It involves the modeling of electrothermal, mechanical, electrical and geometrical characteristics of a thermal bimorph microactuator. Upon studying the principles of a thermal microactuator, the analytical modeling and simulation is achieved through CAD software, Coventorware®. For most materials, when they are heated, it causes an increase in size; and a decrease in size occurs with decreasing temperature. The amount of expansion is small when compared to the overall size of the device undergoing the expansion. Therefore, actuation by thermal expansion must be coupled with a way to amplify the motion or displacement. The best way to amplify the thermal expansion motion is by varying the length of the arm rather than changing the input voltage. For the same material properties of the thermal bimorph microactuator, changing the input voltage consume more electrical power than the one that changes with the length. Normally, the temperature in the thermal bimorph microactuator is only being changed when the applied voltage varies. The displacement of the thermal bimorph microactuator is not affected by the temperature change. The maximum temperature of the thermal bimorph microactuator appears at the middle of the hot arm. The parameters that influence the performance of the thermal bimorph microactuator are also discussed.
dc.identifier.urihttps://erepo.usm.my/handle/123456789/19875
dc.language.isoen
dc.titleModeling and simulation of thermal microactuator
dc.typeResource Types::text::report
dspace.entity.typePublication
oairecerif.author.affiliationUniversiti Sains Malaysia
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