Publication: Fabrication And Characterization Of Embedded Gold Nanoparticles In Metal Contacts For Silicon And Silicon Carbide-Based Devices
| dc.contributor.author | Gorji, Mohammad Saleh | |
| dc.date.accessioned | 2025-06-18T07:32:15Z | |
| dc.date.available | 2025-06-18T07:32:15Z | |
| dc.date.issued | 2014-06 | |
| dc.description.abstract | Embedding metal nanoparticles (NPs) into metal contacts, at the interface with semiconductor, is an alternative method for modification of Schottky barrier height (SBH) in electrical contacts and offers a tremendous simplification and adaptation in processing steps. Schottky barrier diodes with aluminum (Al) contacts embedded with gold (Au) NPs on n- and p-type silicon (Si) and silicon carbide (4H-SiC) substrates were fabricated and their physical and electrical characteristics were investigated. Based on the studies on Si surface contact angle measurement and the negative zeta-potential values of seeded growth 20 nm Au NPs, an alternative approach was proposed to deposit Au NPs on linker-free n- and p-Si substrates using spin-coating technique. Density of NPs (determined by scanning electron microscope) on n-Si was substantially higher than p-Si which was due to the differences in surface properties of n- and p-Si. Current-voltage analysis of diodes revealed an increase in current density in both bias directions due to NPs local electric field enhancement effect and SBH lowering (0.1 1 eV for n- and 0.05 eV for p-Si). The electrical results were then correlated to the structural properties of Al/Si (determined by transmission electron microscope). Higher density of 5 and 10 nm Au NPs were deposited on SiC surface by using acidification technique with diluted HF. Al/4H-SiC diodes showed great improvement in SBH lowering (0.09 eV for n- and 0.24 eV for p-4H-SiC) and hence forward bias current density elevation while maintaining the rectification properties in reverse bias. | |
| dc.identifier.uri | https://erepo.usm.my/handle/123456789/22192 | |
| dc.subject | Fabrication And Characterization Of Embedded Gold | |
| dc.title | Fabrication And Characterization Of Embedded Gold Nanoparticles In Metal Contacts For Silicon And Silicon Carbide-Based Devices | |
| dc.type | Resource Types::text::thesis::master thesis | |
| dspace.entity.type | Publication | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |