Publication:
Universal suction cup for non uniform surface topology

datacite.subject.fosoecd::Engineering and technology::Electrical engineering, Electronic engineering, Information engineering::Electrical and electronic engineering
dc.contributor.authorGeorge, Ting Pek Jing
dc.date.accessioned2025-06-06T02:39:11Z
dc.date.available2025-06-06T02:39:11Z
dc.date.issued2024-07
dc.description.abstractUniversal suction cups are integral tools in various industries due to their ability to adhere to non-porous surface. However, their performance is often compromised on non-uniform surface or uneven surface which includes the surface of a mounted printed circuit board. This research aims to develop an innovative design for a universal suction cup and mechanical arm support that maintains strong adhesion towards non-uniform surface. The study involves designing a universal suction cup that caters the non-uniform surface topology primarily the mounted printed circuit board, designing a mechanical arm that enhances the performance of universal suction cup and test the maximum weight lifted by the universal suction cup. The universal suction cup is tested with increasing weight to identify the maximum weight lifted. Inclusion of mechanical arms that hold four universal suction cups, the result indicates it can lift mounted printed circuit board that showcase its ability to cater the non uniform surface thanks to the miniature size of the universal suction cup. The finding of the study suggests that the universal suction cup design can be widely applied in industries requiring reliable temporary adhesion which includes mounted printed circuit board, potentially reducing the need for specialized equipment. This research contributes to the advancement of adhesion technology and offers practical solutions for expanding the functionality of the universal suction cup.
dc.identifier.urihttps://erepo.usm.my/handle/123456789/22071
dc.language.isoen
dc.titleUniversal suction cup for non uniform surface topology
dc.typeResource Types::text::report::technical report
dspace.entity.typePublication
oairecerif.author.affiliationUniversiti Sains Malaysia
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